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FLEX & RIGID-FLEX PCBs Get Custom Quote
QUICKTURN FLEXIBLE PCB PROTOTYPE AND ASSEMBLY

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CAPABILITIESFLEXRIGID-FLEX
Max. Layer Count12≥ 16
Min. Core Thickness.001 in..002 in.
Min. Starting Cu Foil Thickness O.L.9 micron9 micron
Max. Finished Cu Weight I.L.2 oz.2 oz.
Smallest Mech. Drill Diameter.0079 in..0059 in.
Smallest Laser Drill Diameter.003 in..003 in.
Max. Through Hole Aspect Ratio14:114:1
Max. Blind Via Aspect Ratio.75:1.75:1
Min. Blind Via Finished Hole Size.004 in..004 in.
Min. Buried Via Finished .004 in..004 in.
Min. Drill-to-Copper Clearance.010 in..080 in.
Min. Trace/Space≤.0035 in.≤.0030 in.
Min. Pad Size for Test.005 in..005 in.
Process Pad DiameterD + .014 in. (1-mil annular ring)D + .014 in. (1 mil annular ring)
Stacked ViasYesYes
Min. Wire-Bond Pad Size≥.006 in.≥.006 in.
Controlled Impedance Tolerance10%10%
Solder-Mask RegistrationWithin .002 in.Within .002 in.
Solder-Mask Feature Tolerance.001 in..001 in.
Solder-Mask Min. Dam Size.004 in..002 in.
Min. Diameter Rout Cutter.024 in..024 in.
Mechanical Routed Part Size Tolerance.010 in..010 in.
Laser Hole Location Tolerance.0005 in..0005 in.
Laser Routed Part Size Tolerance (achieved with
panels<.032 in. thick)
.001 in..001 in.
Bow and Twist ToleranceN/A7% along rigid area
Thickness Tolerance10%10%
Sequential Laminations22
Conductive Filled ViasYesYes
Nonconductive Filled ViasYesYes

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HASL (Vertical or Horizontal)
OSP (Shikoku F2)
OSP (Entek)
ENIG
Immersion Silver
Immersion White Tin
Tin Nickel
Electrolytic Soft Au
Electrolytic Hard Au
Selective Au

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Green LDI LPI (Taiyo PSR 9000 LDI)
Taiyo PSR 9000 LDI & FXT
Legends in All Colors

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Polyimide (Kapton) 0.5 mil to 5 mils (.012mm - .127mm)
Adhesiveless Copper Clad Base Material 1 mil to 5 mils
Flame Retardant Laminate, Base Material, and Coverlay
High Performance Epoxy Laminate and Prepreg
High Performance Polyimide Laminate and Prepreg
UL and RoHS Compliant Material on request
High Tg FR4 (170+ Tg), Polyimide (260+ Tg)
Base Copper:
1/3 oz. - .00047 in. (.012mm)--rarely used
1/2 oz. - .0007 in. (.018mm)
1 oz. - .0014 in. (.036mm)
2 oz. - .0028 in. (.071mm)
Solder Mask:
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm - .127mm)
with 0.5 to 2 mil Adhesive (.012mm - .051mm)
LPI and LDI Flexible Soldermasks
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